Attributes Name

Pure Metal Targets

Product Name

Titanium Sputtering Target

Element Symbol

Ti

Purity

3N, 4N, 4N5, 5N

Shape

Disc Targets, Plate Targets, Column Targets, Step Targets, Custom-made

Applications
• Decorative coating 
• Hardware tool coating
• Semiconductor
• Flat panel displays

Features
• Competitive pricing
• High purity
• Grain refined, engineered microstructure
(Average grain size < 20 um)
• Semiconductor grade

Manufacturing Process
• Melting (EB-Electron Beam Melting)
• Analysis
• Casting & Grain refinement
  Forging, Rolling, Annealing, Micrography, Machining
• Cleaning and final packaging - Cleaned for use in vacuum
  Protection from environmental contaminants
  Protection during shipment

Options
• 99.5% minimum purity
• Semiconductor grade titanium alloys available
  Ti/Al, W/Ti 90/10 wt%)
• Smaller sizes also available for R&D applications
• Sputtering target bonding service